GS Nanotech

Technopolis GS High-Tech Centre

One of the leaders in the development, encapsulation and testing of microelectronic products, and the only company in Russia to develop and mass-produce our own microprocessors for consumer electronics. This includes SiP (system-in-package).

Output capacity – up to 20 million microchips per year.

GS Nanotech services

• design and assembly of microchips for SiP, Wire Bond, Flip-Chip, Stack Die, 3D;
• assembly of digital, analogue and hybrid microchips in BGA and LGA housings;
• preparation of silicon wafers with a diameter of up to 300mm by slicing or thinning;
• Chip-On-Board and LED mounting;
• automated functional testing of integrated circuits to JEDEC standards.

Products

• integrated circuits;

Development and encapsulation of integrated circuits for consumer and commercial use.

• Systems-in-Package;

SiP microprocessors of our own design: SiP Amber S2 and SiP Emerald N2M.

• MEMS;

Design and assembly of inertial measuring units (IMUs) based on MEMS sensors;

• SSD

The first SSD solutions developed to be mass-produced in Russia that are equal in every way to their foreign counterparts.