Technopolis GS High-Tech Centre
One of the leaders in the development, encapsulation and testing of microelectronic products, and the only company in Russia to develop and mass-produce our own microprocessors for consumer electronics. This includes SiP (system-in-package).
Output capacity – up to 20 million microchips per year.
GS Nanotech services
- design and assembly of microchips for SiP, Wire Bond, Flip-Chip, Stack Die, 3D;
- assembly of digital, analogue and hybrid microchips in BGA and LGA housings;
- preparation of silicon wafers with a diameter of up to 300mm by slicing or thinning;
- Chip-On-Board and LED mounting;
- automated functional testing of integrated circuits to JEDEC standards.
- integrated circuits;
Development and encapsulation of integrated circuits for consumer and commercial use.
SiP microprocessors of our own design: SiP Amber S2 and SiP Emerald N2M.
Design and assembly of inertial measuring units (IMUs) based on MEMS sensors;
The first SSD solutions developed to be mass-produced in Russia that are equal in every way to their foreign counterparts.